Micros

Infineon and Semikron Danfoss sign supply agreement for electromobility chips

• Micros

12 July 2023

byNews Desk

Networking options enhance vehicle network processors

• Micros

12 July 2023

byNews Desk

Nearfield Instruments’ AUDIRA semiconductor industry’s first non-destructive

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10 July 2023

byNews Desk

Infineon extends its Edge AI capabilities

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7 July 2023

byNews Desk

STMicroelectronics’ GaN driver integrates galvanic isolation for superior safety and reliability

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7 July 2023

byNews Desk

Medical Grade 4:1 DC/DC packs 60W in miniature package

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6 July 2023

byNews Desk

Nexperia launch 600V range IGBT

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5 July 2023

byNews Desk

Parker launch new gap filler pad for high thermal conductivity

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5 July 2023

byNews Desk

Navitas and Plexim announce partnership on PLECS models

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4 July 2023

byNews Desk

Kontron presents new motherboard K3831-H Thin mITX

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4 July 2023

byNews Desk

Infineon launch new automotive-qualified XENSIV MEMS microphone

• Micros

29 June 2023

byNews Desk

STMicroelectronics’ launch galvanically isolated high-side switches

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29 June 2023

byNews Desk

Toshiba introduces ARM Cortex-M3 microcontrollers

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27 June 2023

byNews Desk

Arduino Uno scales performance with new 32-bit versions

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27 June 2023

byNews Desk

MicroCloud for Cloud gaming and video hosting

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26 June 2023

byNews Desk

REYAX launches UART interface ultra-wideband transceiver module

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14 June 2023

byNews Desk

Advanced semiconductor packaging: A new geopolitical battleground

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13 June 2023

byNews Desk

ROHM’s develops new low on resistance Nch MOSFETs

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6 June 2023

byNews Desk

“EU chips investment drop in bucket in grand scheme”

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6 June 2023

byNews Desk

System on module is based on new NXP SoC

• Micros

5 June 2023

byNews Desk