Computer-on-Modules come with 8th Gen Intel Xeon and Intel Core
congatec has introduced its conga-TS370 COM Express Type 6 Computer-on-Modules in parallel with the launch of the 8th Generation Embedded Intel Xeon and Intel Core processors (codename Coffee Lake H). They propel the 35-45W TDP class of COM Express Type 6 modules to a new ‘six-pack’ level of high-end embedded computing, offering for the first time up to 6 cores, 12 threads and a turbo boost of up to 4.4 GHz and drive up to three independent 4k UHD displays.
Initial tests from congatec indicate that these six-core modules offer between 45 to 50% more multi-thread and 15 to 25% more single-thread performance, compared to 7th Gen Intel Core processor based variants.
At a given TPD, system designs achieve higher bandwidth at overall lower power consumption ultimately leading to higher system efficiency. Target applications are high performance embedded and mobile systems, industrial and medical workstations, storage servers and cloud workstations, as well as media transcoding and edge computing cores.
“Markets such as medical imaging and Industry 4.0 as well as video analytics for e.g. situational awareness and transportation observation are keen on any new performance improvement,” explains Martin Danzer, Director of Product Management at congatec.
“We simplify the use of these performance improvements with our standardised Computer-on-Modules, cooling solutions and eAPIs, making upgrading to the latest processor generations more or less a plug & play task.”
Beside performance gains, the congatec modules have extended long-term availability of 10 years plus, high bandwidth I/Os with 4x USB 3.1 Gen 2 (10 Gbit/s) and Intel Optane memory support, as well as enhanced security features including Intel Software Guard extensions, Trusted Execution Engine and Intel Platform Trust Technology.
The conga-TS370 COM Express Basic Type 6 Computer-on-Modules are available with six-core Intel Xeon and Intel Core i7 processors, or quad core Intel Core i5 processors in a 35 to 45W cTDP envelope and up to 32 GB DDR4 2666 memory with ECC option.
The integrated Intel UHD630 graphics supports up to three independent 4k displays with up to 60Hz via DP 1.4 , HDMI, eDP and LVDS. For the first time, designers can switch now from eDP to LVDS purely by software without any hardware change.
The modules are suitable with high bandwidth I/Os including 4x USB 3.1 Gen 2 (10 Gbit/s), 8x USB 2.0 and 1x PEG and 8 PCIe Gen 3.0 lanes for powerful system extensions including Intel Optane memory.
All common Linux operating systems as well as the 64-bit versions of Microsoft Windows 10 and Windows 10 IoT are executable. A premium class personal integration support in combination with an extensive range of accessories as well as standardised or customised carrier boards and systems complete the new modules’ service package.