Samples are mainly intended for evaluation of UFS I/F and its protocol in host chipsets and by OS vendors.
Demand continues to grow for large density, high-performance chips that support high resolution video, driven by improved data-processing speeds in host chipsets and wider bandwidths for wireless connectivity.
Toshiba has proved itself an innovator in this key area, and is now reinforcing its leadership by being first in the industry to support samples with a 64GB UFS module.
Toshiba will schedule mass-production and other densities in its line-up according to market demand.
Key Features
-The JEDEC UFS Ver.1.1 compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products.
-UFS I/F has a serial I/F. It has the scalability in number of lanes and speed.
-The new products are sealed in a small FBGA package, 12x16x1.2mm, and have a signal layout compliant with JEDEC UFS Ver.1.1.