The MX25R6435F Quad SPI NOR Flash memory also has a deep power down current of 200nA as well as fast wake up time with a read current of 6mA, which is an ideal choice to store code and data, especially for low power and XIP applications. MX25R6435F is also available in industry-standard packages, such as compact 8-land WSON, USON and SOP.
Macronix’s MX25R6435F is manufactured on its own 75nm technology node and the Macronix 10-year Product Longevity Program. ST’s new STM32L496/4A6 ultra-low-power microcontrollers (MCUs) use ARM Cortex -M4-core processing power and efficiency. They are also the ideal choice for a wide range of applications including wearables, industrial sensors, home automation and audio and metering systems.
The STM32L496/4A6 features up to 1MB of internal Flash, 320KB internal SRAM (320KB), and advanced features such as ST’s Chrom-ART advanced graphic acceleration, camera interface, 2 x CAN, and 4 x I2C.
The Flexible Memory Controller (FMC) and dual Quad-SPI interface simplify off-chip memory expansion allowing practically unlimited application code size. With the new STM32L496/4A6 microcontrollers, ST is demonstrating its commitment to provide the best-in class ultra-low-power microcontroller solutions while adding performance and advanced features.
“Macronix’s ultra-low power Quad- SPI Flash memory solution enabled to exploit the unique ultra-low-power features of the STM32L4 MCUs to offer a complete system solution focused on low power, performance and cost,” said Daniel COLONNA, MCU Marketing Director, STMicroelectronics.
“We are pleased that STMicroelectronics has selected our ultra-low-power NOR Flash memory for its new advanced microcontroller (MCU) Discovery Kit and take the cooperation in between as a great recognition of the excellence of our products.” said Macronix’s Vice President of Marketing, Ful-Long Ni “Our MX25R Quad-SPI Flash memory has a small footprint that is ideal for space-constrained smart appliances and devices and its low power and wide voltage range operation are tailored to overcome the challenges of new wearable and IoT devices”.