The new products integrate NAND chips fabricated with 15nm process technology and are designed for industrial applications, including PLC, CoMs and factory automation equipment, and can also be used in a wide range of consumer applications.
The line-up offers densities of 8GB, 16GB, 32GB and 64GB. Sample shipments start from today, with mass production scheduled for March 2017.
The new products integrate NAND chips with a controller to manage basic control functions for NAND applications in a single package. As a complement to Toshiba’s current industrial product group of e∙MMC, which have an operating temperature range of -40 to 85°C, the new e∙MMC product family support applications that require e∙MMC storage solutions to operate at higher temperatures up to 105°C.
This enhanced range offers users more freedom of choice in developing memory solutions for industrial applications in high temperature environments.
In the consumer and industrial market demand for e∙MMC with high temperature support continues to grow for applications requiring higher performance and higher power consumption. Toshiba is meeting this demand by reinforcing its line-up of high performance and high density memory products and will continue to take leadership in the market.