The design of the XPG V3 series enables stable data transfer. The overclocking DRAM features 8-layer PCBs with 2oz copper, which decreases electric resistance, consumes less power and lowers EMI. As well as this, every chip has contact with the heat sinks, ensuring the IC and PCB operate in an environment of equal temperature.
The detachable fin heat sinks can be replaced and fastened by screws, making the series more durable for long-term use. An additional pair of fins, included in the package for the 1st lot of shipment, allows users to exchange the fins.
The XPG V3 series, which is RoHS compliant, comes with a spare pair of fin heat sinks and a lifetime warranty.
