Memory

Multi-project wafer service with integrated silicon OxRAM

2nd August 2018
Alex Lynn

Research institute at CEA Tech, Leti, and CMP, a service organisation that provides prototyping and low volume production of ICs and MEMS, have announced the multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base wafer platform.

Available on Leti’s 200mm CMOS line, the MPW service provides a comprehensive, low cost way to explore techniques designed to achieve miniaturised, high density components. Including Leti’s Memory Advanced Demonstrator (MAD) future mask set with disruptive OxRAM (oxide-based resistive RAM) technology, Leti’s integrated silicon memory platform is developed for backend memories and non-volatility associated with embedded designs. The new technology platform will be based on HfO2/Ti (titanium-doped hafnium oxide) active layers.

Emerging OxRAM non-volatile memory is one of the promising technologies to be implemented for classical embedded memory applications on advanced nodes like micro-controllers or secure products, as well as for AI accelerators and neuromorphic computing.

Leti’s MAD platform is dedicated to advanced non-volatile memories, bringing both versatility and robustness for material and interface assessment, and allowing in-depth exploration of memory performance from technology and design perspectives.

The full platform’s highlights:

  • 200mm STMicroelectronics HCMOS9A base wafers in 130nm node.
  • All routing is made on ST base wafers from M1 to M4 (included).
  • Leti’s OxRAM memory module is fabricated on top.
  • One level of interconnect (i.e. M5) plus pads are fabricated in Leti’s cleanroom.

Etienne Nowak, Head of the Leti’s Advanced Memory Lab, stated: “Leti has developed during the past 20 years deep expertise in non-volatile memory (NVM) devices covering flash evolutive solutions and disruptive technologies. This MPW capability, combined with our Memory Advanced Demonstrator platform, is based on a broad tool box that enables customised research with our partners, and provides a benchmark between different NVM solutions.”

The MPW service with integrated silicon OxRAM addresses all the key steps of advanced memory development. These include material engineering and analysis, developing critical memory modules, evaluation of memory cells coupled with electrical tests, modelling and innovative design techniques to comply with circuit design opportunities and constraints. This technology offer comes with a design kit, including layout, verification and simulation capabilities. Libraries are provided with a comprehensive list of active and passive electro-optical components. The design kit environment is compatible with all offers through CMP.

Providing access to a non-volatile memory process from Leti is a major achievement in development work at CMP. With this new offer in place, the CMP users’ community can have the benefits and advantages of using this process through this close collaboration between CMP and Leti.

Jean-Christophe Crébier, director of CMP, stated: “CMP has a long experience providing smaller organisations with access to advanced manufacturing technologies, and there is very strong interest in the CMP community in designing and prototyping ICs using this process. It is an opportunity for many universities, start-ups and SMEs in France, Europe, North America and Asia to take advantage of this new technology and MPW service.”

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