Kontron announces COM-HPC mini module development
Kontron, a global provider of IoT/Embedded Computer Technology (ECT), has revealed the development of a COM-HPC Mini module, following the COM-HPC 1.2 specification ratified by PICMG on 6th October 2023.
PICMG's ratification of the COM-HPC 1.2 specification to include COM-HPC Mini considerably broadens the scope of the high-performance standard. This expansion allows customers to benefit from the standard's wide scalability, opening up new application opportunities.
The COM-HPC Mini module, measuring 95mm x 70mm, adds a more compact option to the COM-HPC range, in contrast to the larger client and server formats. It features a high-speed 400-pin connector, which includes two 10GbE interfaces and 16x PCIe lanes capable of supporting up to PCIe Gen5, as well as four USB 4 interfaces with Thunderbolt and DisplayPort Alternate Mode. These specifications cater to the increasing demands for high-speed IO interfaces in small form factor segments.
Kontron is developing this COM-HPC Mini module using the next generation Intel CoreTM technology. This development aims to provide a high-performance solution in a compact, space-saving format, ideal for compute-intensive applications and demanding control and visualisation tasks with limited space.
With the addition of the COM-HPC Mini to Kontron's extensive range of COM-HPC implementations, which vary in performance levels and functionalities, users can now select the perfect module to meet the specific requirements of their individual IIoT applications.
Irene Hahner, Product Manager COM-HPC Modules at Kontron, stated: "COM-HPC Mini enables the integration of ultra-high-performance COMs in the smallest application areas. It is crucial that the technical possibilities of the Intel Next Gen CoreTM platforms can be fully utilised."