“System designers are always looking for ways to increase performance yet consolidate space when converging video, data and voice applications,” said John Hicks, product manager, Molex. “The RF DIN 1.0/2.3 Modular Backplane System provides them with a subminiature form ideal for tight spaces yet still delivering a superior method for routing of RF signals.”
The modular board-to-board system offers multiple options including a standard four port, 75 Ohm contact version or customizable six, eight and 10 ports with 50 Ohm contacts.
The DIN 1.0/2.3 interface allows up to 1.00 mm of axial engagement tolerance, providing users with increased flexibility when mating orthogonal PCBs.
The RF DIN 1.0/2.3 backplane system is the only one on the market capable of increasing board-to-board content for DC to 3 GHz frequency applications making it ideal for CATV, communication systems and high-density radio applications.
The connectors also feature a push-pull coupling design for quick installation and a plastic housing that engages before the RF contact to prevent damage from stubbing.