The types are available in IEC case size 1005 (EIA 0402) and measure a miniature 1.0 mm x 0.5 mm x 0.5 mm. Thanks to these features the new MMZ1005-V Gigaspira beads are ideally suited for noise suppression in smartphones, tablet PCs and other mobile communication devices. Production of the new MMZ1005-V Gigaspira beads begins in September 2013.
The benchmark performance of the TDK MMZ1005-V series was made possible thanks to the use of new ferrite material. Depending on type, the new beads offer a maximum DC resistance of between 0.9 Ω and 1.6 Ω and a rated current of 150 mA to 250 mA. With the addition of the new series to the standard MMZ1005 series and the wideband MMZ1005-E Gigaspira series, TDK’s lineup of chip beads now covers an even wider range of requirements for noise suppression in signal lines.