The market requires shorter development times for devices like mobile phones and wants RF components that are smaller and offer multiband capability. Using modules developed based on Murata Manufacturing high-frequency signal technology, designers can configure RF components that support high functionality and compact size in circuit design and check that these modules function and meet the conditions required to serve in mobile phones before offering them to customers.
The evaluation system will be on display at CEATEC JAPAN 2011 at Makuhari Messe in Chiba Prefecture, October 4-8.
Features
Supports Band I, V, IX, (11, 21) GSM_Quad
Footprint: 235mm2
Applications
LTE/W-CDMA/GSM system
