Popular IP67 snap-in connector now with dip-solder contacts
AWR White Paper Describes Benefits of Co-Simulation Between High-Frequency and Thermal Analysis Tools In MMIC Design
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AWR White Paper Describes Benefits of Co-Simulation Between High-Frequency and Thermal Analysis Tools In MMIC Design

AWR has released a new white paper entitled “An Electrical-Thermal MMIC Design Flow” that demonstrates, using an actual design example, the effectiveness of co-simulation between AWR’s Microwave Office high-frequency design software and CapeSym’s SYMMIC thermal analysis tool. An X-band RF power amplifier/low-noise amplifier MMIC for a transceiver application was designed in Microwave Office software and thermal coupling and other issues between the two circuits on the single die were quickly remedied with SYMMIC to produce optimum results.

Please download the whitepaper to continue reaidng.

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