MachXO3L FPGAs are now available in WLCSP & caBGA packages
Lattice Semiconductor has revealed that its popular MachXO3L family of FPGAs are now available in four tiny packages as small as 2.5x2.5mm. According to the manufacturer, the FPGAs offer the lowest cost per I/O in the industry with WLCSP (Wafer-Level Chip-Scale) and caBGA (Chip-Array Ball Grid Array) packages providing up to 335 I/O in a 17x17mm package.
The MachXO3L family integrates a regulator to simplify system design, eliminate thermal constraints and help engineers realise power efficient, always-on devices. Suited for controlling bring-up and system initialisation, the FPGAs feature a boot-up time of less than 1ms coupled with background system upgrade capability, dual boot and a single supply. Enabling engineers to improve reliability and reduce cost, the MachXO3L devices include hardened IP blocks, such as I2C, SPI, embedded memory and an oscillator, in an instant-on programmable fabric.
Lattice has also introduced two low-cost breakout boards enabling designers to evaluate the MachXO3L device’s hard IP, versatile I/O and other capabilities. Using these boards, engineers can quickly solve complex design problems in applications as diverse as industrial infrastructure and smart connected devices.
Keith Bladen, Corporate Vice President, Marketing, Lattice Semiconductor, commented: “Lattice is clearly ahead of its competition with a rich 25-year legacy of instant-on products. Our non-volatile FPGA portfolio leads the industry with advanced 40nm technology, power as low as 19mW and the industry’s widest density range with 256-40,000 LUT devices in production today. The demand for MachXO3L devices is strong and growing with nearly 200 unique customers across a wide range of markets including industrial, communications and consumer.”