FPGAs

Low power FPGAs enable connectivity to ASICs and ASSPs

1st November 2016
Alice Matthews
0

The availability of ECP5-5G-based IP and solutions has been announced by Lattice Semiconductor Corporation, which are part of the company’s ECP5 family of low power, small form factor connectivity FPGAs for industrial and communications applications. This product family enables seamless connectivity to ASICs and ASSPs in a wide array of applications.

These applications include small cells, low-end routers, backhaul, low-power radios, cameras, machine vision and gaming platforms.

Lattice’s ECP5-5G family has been optimised to provide the lowest cost, power consumption, and form factor solution for 5G SERDES applications. These devices support multiple 5G SERDES protocols including Peripheral Component Interconnect (PCI) Express 2.0, Common Public Radio Interference (CPRI) and the JESD204B serial interface.

The ECP5-5G devices are complemented with a portfolio of development kits, soft IP, demos and updated design software:

  • The ECP5-5G Versa development kit enables users to evaluate key connectivity features of the device family including PCI Express Gen 2.0 support.
  • The Connectivity IP suite includes a portfolio of commonly used interface IP cores such as PCI Express, CPRI, JESD204B, Ethernet MAC, and DDR3 controllers. Lattice’s Lattice Diamond design software now supports general availability of ECP5-5G device family.

“With 5G SERDES connectivity, Lattice’s ECP5-5G family is a useful solution to address applications where quick time to market, small form factor and cost-effectiveness are critical,” said Deepak Boppana, Director of Product Marketing at Lattice Semiconductor. “In addition, by offering promotional pricing on the development kits, IP suite, and design software, we’re giving our customers increased access – at an affordable price point – to the technology they rely on for the development of a wide array of industrial and communications solutions.”

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier