FPGAs

FPGA board facilitates large buffer sizes

6th January 2020
Alex Lynn

VadaTech has announced the AMC573, which utilises the Xilinx XCZU28DR RFSoC and is compliant to AMC.1, AMC.2, AMC.3 and AMC.4 specifications. It has an onboard, re-configurable FPGA which interfaces directly to the AMC FCLKA, TCLKA-D. The module has two banks of 64-bit wide DDR4 memory with ECC (16 GB in total). This allows for large buffer sizes to be stored during processing as well as for queueing the data to the host.

The XCZU28DR includes a quad-core ARM Cortex-A53 application processing unit and dual-core Cortex-R5 real-time processing as well as over 4,200 DSP, 930 K logic cells and over 60 Mb of internal memory (including 22.5 Mb of UltraRAM). The chip also includes a soft-decision FEC block supporting low-density parity check (LDPC) decode/encode and Turbo decode for use in 5G wireless, backhaul, DOCSIS, and LTE applications. The Module has onboard 64 GB of Flash, 128 MB of boot flash and an SD Card as an option.

The front panel incorporates 18 high-density RF Coaxial connectors routed to the 8 ADC (12-bit @ 4 GSPS) and 8 DAC (14-bit @ 6.4 GSPS) in the RFSoC. Also included are Trig-in, Trig-out, clock inputs, dual USB, dual serial ports via MicroUSB a DisplayPort interface and a high-density connector for external I/O. 

The default I/O is 8 LVDS or single ended +1.8V I/O but can be modified to meet customer requirements.

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