Heat sink provides non-inductive, high dissipation

12th June 2020
Mick Elliott

A heat sink device with enhanced power size ratio, high stability and optimum heat dissipation is in stock at New Yorker Electronics.

The Tepro TO-220 Non-Inductive, Thick-Film Heat Sink Resistor in the TO-20 Type is typical application for this is switching power supplies and various types of pulse circuits.

It features a plated copper heat sink, a high stability thick-film element and tinned copper leads. It also has high temperature thermoset moulding.

Custom models are available with variations in lead length, tolerance to 0.5%, and temperature coefficients.

It is terminal strength tested at a 5lb. pull and its solderability and solvent resistance meet MIL-STD-202 requirements.

Many of Tepro’s precision and power resistors are custom designed and have the ability to meet very tight tolerances and even tighter lead times – including custom magnetics, microwave, resistors and wound film capacitors.

Tepro has been designing and manufacturing both wirewound resistors and metal film resistors for their chassis mount resistor, power resistor and surface mount resistor lines in both standard resistor and custom resistor models.

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