UltraScale+ portfolio for high-performance edge solutions
Xilinx has announced the company has expanded its UltraScale+ portfolio for new markets and applications that require ultra-compact and intelligent edge solutions. With new form factors that are 70% smaller than traditional Xilinx chip-scale packaging, the new Artix and Zynq UltraScale+ families can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.
As a hardware adaptable cost-optimised portfolio based on 16 nanometer technology, Artix and Zynq UltraScale+ are available in TSMC’s InFO (Integrated Fan Out) packaging technology. Using InFO, the new cost-optimised members of the Artix and Zynq UltraScale + family meets the need for intelligent edge applications by delivering high-compute density, performance per-watt, and scalability in an ultra-compact package.
“Demand for compact, intelligent edge applications is driving the requirement for processing and bandwidth engines to not only provide higher performance, but also new levels of compute density to enable the smallest form factor systems,” said Sumit Shah, Senior Director, Product line Management and Marketing at Xilinx. “The two new cost-optimised additions to our UltraScale+ families are powerful enhancements that leverage the history and field-proven technology of Xilinx’s UltraScale+ FPGAs and MPSoCs, which collectively have been deployed in millions of devices worldwide.”
Artix UltraScale+ FPGAs: built for high I/O bandwidth and DSP compute
The new Artix UltraScale+ is built on its field-proven FPGA architecture and is ideal for a range of applications including machine vision with advanced sensor technology, high-speed networking, and ultra-compact ‘4K-ready’ video broadcasting.
Artix UltraScale+ delivers 16 gigabits per-second transceivers to support emerging and advanced protocols in networking, vision, and video, while also delivering the highest DSP compute in its class.
Zynq UltraScale+ MPSoCs: optimised for power and cost
Cost-optimised Zynq UltraScale+ MPSoCs include the new ZU1 device and production-proven ZU2, and ZU3, all available in InFO factor packaging. As part of the Multi-Processing SoC line from the Zynq UltraScale+ family, the new ZU1 is designed for connectivity at the edge and for industrial and healthcare IoT systems, including embedded vision cameras, AV-over-IP 4K and 8K-ready streaming, hand-held test equipment, as well as consumer and medical applications.
ZU1 is built for miniaturised compute-intensive applications and powered by a heterogenous Arm-based multi-core processor subsystem, while also being able to scale to ZU2 and ZU3-based devices for greater compute.
“LUCID has worked closely with Xilinx to integrate the new UltraScale+ ZU3 into our next generation industrial machine vision camera, the Triton Edge,” said Rod Barman, Founder and President at LUCID Vision Labs. “With the UltraScale+ ZU3 and its InFO packaging, LUCID was able to utilise an innovative rigid-flex board architecture to squeeze an amazing amount of processing power into an ultra-compact IP67, factory tough camera.”
Artix and Zynq UltraScale+ are scalable and secure
With the Xilinx Artix and Zynq UltraScale+ portfolio now extended from the high-end to the low-end, extending platform scalability ensures customers can develop multiple solutions using the same Xilinx platform. This preserves design investments across the portfolio and speeds time-to-market.
Security is a critical component in Xilinx designs, and both members of the cost-optimised Artix and Zynq UltraScale+ families include the same robust security features found across the UltraScale+ platform. Included are RSA-4096 authentication, AES-CGM decryption, DPA counter-measures, and Xilinx’s proprietary Security Monitor IP that adapts to security threats across the product lifecycle, meeting the security needs for both defense and commercial projects.
“The ability for customers to scale their designs using a single secure platform for a wide range of applications and markets is key to enabling faster, easier design integration as well as for capturing critical time-to-market opportunities,” said Dan Mandell, Senior Analyst, IoT and Embedded Technology at VDC Research. “Xilinx’s strategy to expand its portfolio to meet these market needs with its scalable and secure UltraScale+ Artix and Zynq family is compelling, especially considering the strong business opportunities in growth markets where these solutions are being deployed.”
The new cost-optimised Artix UltraScale+AU25P and AU20P models are expected to be available in production by mid-summer. Zynq UltraScale + ZU2 and ZU3 models are currently sampling with volume production of ZU1, ZU2, and ZU3 expected to begin Q4 CY2021.