Thermal fatigue-resistant solder paste for high-reliability requirements

7th June 2024
Paige West

SHENMAO Technology announces the development of its new thermal fatigue-resistant solder paste, PF918-P250.

Designed to meet high-reliability requirements, PF918-P250 offers advanced features and performance for electronic products requiring exceptional durability.

Features of PF918-P250:

  • Halogen-free (ROL0): no halogen is intentionally added, ensuring compliance with RoHS, RoHS 2.0, and REACH regulations
  • Excellent voiding performance: minimises void formation, enhancing solder joint integrity
  • Good printability: ensures consistent and precise application in various manufacturing processes
  • New SHENMAO Alloy: exhibits excellent thermal fatigue resistance, significantly improving reliability in thermal shock and thermal cycling tests

PF918-P250 is formulated with high-strength solder material, designed for long-service life electronic products with stringent reliability requirements. This solder paste incorporates the newly designed high-reliability lead-free alloy PF918, which boasts a tensile strength performance 1.4 times greater than the typical SAC305 alloy.

Moreover, PF918 demonstrates top thermal cycling reliability, making it ideal for automotive devices and high-power components with demanding thermal reliability needs. Board-level thermal cycling tests with real automotive IC products reveal that the thermal cycling life of PF918 is twice that of the SAC305 alloy.

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