Texas Instruments’ condition monitoring module

TI integrated circuits and reference designs will help you to jumpstart your condition monitoring module through a high speed signal chain, powerful processing and different wired and wireless interfaces to connect to the external world according to your needs:
  • High-resolution, high-speed conversion with low-power and small-footprint vibration front end
  • Efficient scalable FFT processing to predict potential machine failures
  • Edge processing to reduce system power and lower network bandwidth

Discover more here.

Keep Up to Date with the Most Important News

By pressing the Subscribe button, you confirm that you have read and are agreeing to our Privacy Policy and Terms of Use
Previous Post

Texas Instruments' condition monitoring sensor

Next Post

Collaboration on next-gen data centre solutions