Socionext, the solution SoC company, recently announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of complete solutions for consumer, AI, and HPC data centerapplications that include chiplets, 2.5D, 3D, and 5.5D packaging. Socionext empowers customers with a proven development process and unmatched expertise delivering high- performance, high-quality solutions that accelerate innovation and success.
As a key milestone, Socionext has successfully taped out a complete packaged device leveraging TSMC’s SoIC-X 3D stacking. The design combines an N3 compute die and an N5 I/O die in a face-to-face (F2F) configuration. The F2F 3D stacking approach minimises interconnect distance, significantly reduces signal latency and power consumption compared to traditional 2D and 2.5D designs.
Building on the company’s experience in 2.5D designs, Socionext applies proven design experience and methodologies to 3DICs, which stack components vertically to unlock key advantage3DIC F2F and 5.5D Structure
3D ICs facilitate the integration of different technology nodes (3nm, 5nm, 7nm) and functions (e.g., logic, memory, interface) into a single package, allowing for more optimally partitioned solution addressing performance, density, and cost.
Vertical stacking enables greater functionality in a smaller footprint—an essential advantage as traditional scaling nears itslimits. This is especially valuable for space-constrained consumer devices.
Shorter, wider connections between dies reduce latency and boost bandwidth.
Compact interconnects result in reduced drive requirements due to lower impedance.
The introduction of 3DIC along with 5.5D support reflects Socionext’s commitment to advancing heterogeneous integration, bringing together multiple functions within a unified system of semiconductors and packaging elements. As demand grows for scalable, high-density, and energy-efficient platforms, especially in consumer, AI, and data centre applications, 3DICs will play apivotal role in shaping the future of semiconductor innovation.
“Socionext’s extensive experience in SoC design and our collaboration with TSMC position us at the forefront of next-generationSoC development,” said Rajinder Cheema, CTO and Executive Vice President, tSocionext. “This milestone reflects our dedication to delivering cutting-edge solutions that meet the evolving needs of our customers.”
