The device integrates the core of the BeagleBone Black — the AM3358 processor, the TI TPS65217C power management IC (PMIC), the TI TL5209 low dropout (LDO) voltage regulator, 512MBytes of DDR3 SDRAM, and over 140 passive components — into a single BGA package.
Through this integration, the OSD3358 removes the complexities of power sequencing and DDR-to-processor interfacing that are typical in the design process.
At the same time, the single package simplifies the supply chain and facilitates lower-cost manufacturing.
Developers can prototype software on the BeagleBone Black Wireless and then seamlessly transition it to custom boards that include the OSD3358 SiP without loss of performance.