Single-chip adaptable radio platform for 5G wireless applications

27th February 2019
Lanna Cooper

Xilinx announced it has extended its Zynq UltraScale+ radio frequency SoC portfolio with greater RF performance and scalability. Building on the multi-market success of the Zynq UltraScale+ RFSoC base portfolio, next-gen devices can cover the entire sub-6GHz spectrum, which is a critical need for next-gen 5G deployment. They support direct RF sampling of up to 5GS/S 14-bit Analogue-to-Digital Converters (ADCs) and 10GS/S 14-bit Digital-to-Analogue Converters (DACs), both up to 6GHz of analogue bandwidth.

Xilinx’s RFSoC portfolio is the only single-chip adaptable radio platform that is designed to address current and future industry requirements.

The portfolio now includes:

  • Xilinx Zynq UltraScale+ RFSoC Gen 2: Sampling now with production scheduled for June 2019, this device meets regional deployment timelines in Asia and supports 5G New Radio.
  • Xilinx Zynq UltraScale+ RFSoC Gen 3: Provides full sub-6GHz direct-RF support, extended millimeter wave interface, and up to 20% power reduction in the RF data converter subsystem compared to the base portfolio. The product will be available in 2H 2019.

The new products monolithically integrate higher performance RF data converters that deliver the broad spectrum coverage required for the deployment of 5G wireless communications systems, cable access, advanced phased-array radar solutions and additional applications including test and measurement and satellite communications.

By eliminating discrete components, the devices enable up to a 50% power and footprint reduction, making them suitable for the needs of telecommunications operators seeking to enable massive multiple-input, multiple-output base stations for their 5G systems.

“We are committed to helping our customers accelerate innovation, and are especially excited to drive the development of adaptable, intelligent 5G infrastructure with these new, higher performing additions to the Zynq UltraScale+ RFSoC portfolio,” said Liam Madden, Executive Vice President of Hardware and Systems Product Development, Xilinx.

“Now with complete coverage of sub-6GHz spectrum bands, it will give our customers even more of a competitive advantage by allowing them to accelerate the design and development of next-gen systems today.”

With pin-compatibility across the portfolio, customers can design and deploy their systems now using first-generation devices with a roadmap to Gen 2 and Gen 3 for greater performance.

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