According to Dermott Lynch, VP Marketing at Silicon Frontline, “To address our customers’ post-layout verification needs as their technology options change, we are focused on improving our software products’ performance and our products’ capacity to handle full-chip designs.”
F3D is chosen for providing nanometer and Analog Mixed Signal (A/MS) design accuracy and R3D for its ability to improve the reliability and efficiency of semiconductor power devices.
F3D and R3D incorporate patent-pending 3D technology to deliver a Guaranteed Accurate solution for full-chip, post-layout verification. They work in industry standard flows allowing simpler adoption and quicker closure, with guaranteed accuracy, of the post-layout verification loop.