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IO-Link: making the connection from sensor to Edge computing

IO-Link: making the connection from sensor to Edge computing

IO-Link: making the connection from sensor to Edge computing

6 March 2026

Littelfuse/C&K introduces TDB series miniature mount DIP switches

Littelfuse/C&K introduces TDB series miniature mount DIP switches

Littelfuse/C&K introduces TDB series miniature mount DIP switches

11 April 2026

High-performance dual-core MCUs for motor control

High-performance dual-core MCUs for motor control

High-performance dual-core MCUs for motor control

11 April 2026

The UK pothole crisis: can technology finally fix our roads?

The UK pothole crisis: can technology finally fix our roads?

The UK pothole crisis: can technology finally fix our roads?

10 April 2026

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Popular Searches

Trending Now

IO-Link: making the connection from sensor to Edge computing

IO-Link: making the connection from sensor to Edge computing

IO-Link: making the connection from sensor to Edge computing

6 March 2026

Littelfuse/C&K introduces TDB series miniature mount DIP switches

Littelfuse/C&K introduces TDB series miniature mount DIP switches

Littelfuse/C&K introduces TDB series miniature mount DIP switches

11 April 2026

High-performance dual-core MCUs for motor control

High-performance dual-core MCUs for motor control

High-performance dual-core MCUs for motor control

11 April 2026

The UK pothole crisis: can technology finally fix our roads?

The UK pothole crisis: can technology finally fix our roads?

The UK pothole crisis: can technology finally fix our roads?

10 April 2026

Home Products Design Page 4

Belgian materials group Syensqo has launched a new low-density high-performance polyamide designed to make consumer electronics lighter without sacrificing strength or design quality, as device manufacturers race to slim down their hardware.

Belgian materials group Syensqo has launched a new low-density high-performance polyamide designed to make consumer electronics lighter without sacrificing strength or design quality, as device manufacturers race to slim down their hardware.

Syensqo launches lightweight polymer to slim down next-gen consumer electronics

Design

20 October 2025

Low-temperature solder paste for AI server cooling assembly

Low-temperature solder paste for AI server cooling assembly

Low-temperature solder paste for AI server cooling assembly

Design

18 October 2025

AI simulation for automotive component design and manufacturing

AI simulation for automotive component design and manufacturing

AI simulation for automotive component design and manufacturing

14 October 2025

Engineers empowered with advanced selective soldering training

Engineers empowered with advanced selective soldering training

Engineers empowered with advanced selective soldering training

13 October 2025

YINCAE launches UF 66L optical clear underfill

YINCAE launches UF 66L optical clear underfill

YINCAE launches UF 66L optical clear underfill

10 October 2025

Electronic Design Automation firm Pulsonix has launched version 14.0 of its PCB design platform, introducing an integrated simulation engine, enhanced 3D inspection tools, and a range of workflow improvements aimed at addressing the growing complexity of modern electronics systems.

Electronic Design Automation firm Pulsonix has launched version 14.0 of its PCB design platform, introducing an integrated simulation engine, enhanced 3D inspection tools, and a range of workflow improvements aimed at addressing the growing complexity of modern electronics systems.

Pulsonix targets design efficiency with integrated simulation and workflow overhaul

Design

9 October 2025

Renesas Electronics Corporation has unveiled a new range of magnet-free inductive position sensor (IPS) chips aimed at industrial and robotic applications, in a move to challenge traditional magnetic and optical encoders that dominate the precision sensing market.

Renesas Electronics Corporation has unveiled a new range of magnet-free inductive position sensor (IPS) chips aimed at industrial and robotic applications, in a move to challenge traditional magnetic and optical encoders that dominate the precision sensing market.

Renesas targets encoder market with launch of magnet-free industrial sensors

9 October 2025

Alphawave Semi has announced the successful tape-out of its latest ultra-high-speed connectivity technology, marking a major step forward in three-dimensional chiplet integration for advanced computing.

Alphawave Semi has announced the successful tape-out of its latest ultra-high-speed connectivity technology, marking a major step forward in three-dimensional chiplet integration for advanced computing.

Alphawave Semi advances 3D chiplet integration with latest TSMC collaboration

7 October 2025

NanoFlowX to showcase full nanocoating lineup at SMTA International

NanoFlowX to showcase full nanocoating lineup at SMTA International

NanoFlowX to showcase full nanocoating lineup at SMTA International

6 October 2025

Nanosilica filled, dual curable adhesive

Nanosilica filled, dual curable adhesive

Nanosilica filled, dual curable adhesive

Design

26 September 2025

Siemens Digital Industries Software is collaborating with Advanced Semiconductor Engineering (ASE), to develop a 3Dblox-based workflows

Siemens Digital Industries Software is collaborating with Advanced Semiconductor Engineering (ASE), to develop a 3Dblox-based workflows

Siemens and ASE developing a 3Dblox-based workflow

Design

26 September 2025

byPaige Hookway

At the 2025 TSMC North America Open Innovation Platform Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC

At the 2025 TSMC North America Open Innovation Platform Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC

Siemens and TSMC collaborating on certification and design solutions

Design

25 September 2025

byPaige Hookway

Expanded couplings range from Ruland:

Expanded couplings range from Ruland:

Expanded couplings range from Ruland: for light-duty applications

Design

23 September 2025

Siemens Digital Industries Software announced Tessent IJTAG Pro software, which will transform IJTAG input/output

Siemens Digital Industries Software announced Tessent IJTAG Pro software, which will transform IJTAG input/output

Siemens introduces Tessent IJTAG Pro

Design

23 September 2025

Breakthrough in hermetic packaging enhances image sensor reliability

Breakthrough in hermetic packaging enhances image sensor reliability

Breakthrough in hermetic packaging enhances image sensor reliability

18 September 2025

RS, a global product and service solutions provider for industrial customers, have launched the DesignSpark PCB version 13

RS, a global product and service solutions provider for industrial customers, have launched the DesignSpark PCB version 13

DesignSpark PCB version 13 simplifies circuit board design

Design

17 September 2025

byPaige Hookway

Infineon unveils 12kW PSU reference design for AI data centres

Infineon unveils 12kW PSU reference design for AI data centres

Infineon unveils 12kW PSU reference design for AI data centres

11 September 2025

byPaige Hookway

Production-ready embedded Linux solutions with Ubuntu Pro

Production-ready embedded Linux solutions with Ubuntu Pro

Production-ready embedded Linux solutions with Ubuntu Pro

Design

10 September 2025

byPaige Hookway

Vector launches SDx Cloud for software-defined systems

Vector launches SDx Cloud for software-defined systems

Vector launches SDx Cloud for software-defined systems

Design

9 September 2025

FUCHS Lubricants has announced the release of RENOLIN FECC 10 SYN, a premium, single-phase immersion cooling fluid

FUCHS Lubricants has announced the release of RENOLIN FECC 10 SYN, a premium, single-phase immersion cooling fluid

FUCHS Lubricants releases cooling fluid

Design

9 September 2025

byPaige Hookway