Design

Third generation programming architecture supports largest flash devices

13th November 2009
ES Admin
0
The new FlashPAK III is the third generation programming architecture specifically designed to support the largest flash devices while keeping your production processes running at maximum speed. The FlashPAK III Networked Programming System supports the latest high-density Flash memory, NAND Flash, Managed NAND Flash, Microcontroller and EEPROM devices at maximum programming speeds and highest quality per device. FlashPAK III is the third generation programming architecture specifically designed to support the largest flash devices while keeping your production processes running at maximum velocity.
In addition to the huge library of existing FlashPAK support for Flash, NAND and Microcontrollers, the FlashPAK III adds the capability to efficiently program all types of managed NAND devices like MoviNAND, iNAND, eMMC etc., and devices of any size.





FlashPAK III is designed to give the highest production throughput possible. FlashPAK III is capable of reading and writing to devices at speeds greater than 10 MBytes/second. In addition, the job download speed has been improved dramatically to enable fast job changeovers. Finally, the field configurable FPGA can be optimized for any device.



The FlashPAK III is ideal for first article builds and NPI applications. As your product moves to higher volume production, the programming tasks can be easily transferred to Data I/O's automated FlashCORE programming systems without altering the programming itself.



The FlashPAK III system can grow with your business needs. Start with a single FlashPAK III, then, as you need more sites to increase throughput, add more units. Connect through FlashPAK III Ethernet interface and create an 8/12/16-site system. FlashPAK III's low price point and full featured versatility lowers the programming cost per device while providing an extremely effective and predictable ROI equation on the capital investment.

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