LEDPaste NC38HF combines wetting performance with stencil print transfer efficiency to satisfy the range of process requirements for miniLED applications. It offers excellent printability down to 60-micron apertures. MiniLEDs typically feature a length of less than 240 microns on the component edge; this material offers excellent compatibility with the current size of miniLEDs and as future die continue to miniaturise.
LEDPaste NC38HF delivers:
- Consistent and tight solder deposit spread across multiple prints and excellent response-to-pause characteristics
- Minimal voiding on tight-pitch components, ensuring joint strength on small components
- Industry-leading non-wet open (NWO) performance using superior oxidation barrier technology, enabling reduced solder ball and solder beading defects and enhanced graping performance
- Enhanced slump performance with minimal bridging during the assembly process, improving yields for tight-pitch components
A proven product, LEDPaste NC38HF was recognised with an award for Excellent Product of the Year at the MiniLED conference in Shenzhen, China on November 10th.
Indium Corporation is a materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.