FloorDirector 3.5 Provides Significant Dynamic Power Integrity Benefits at 28 nm

Version 3.5 provides significant speed-ups, major usability enhancements, and an innovative new Pulse Softening™ capability, helping designers at 28 nm and below to achieve benefits on primary design targets such as yield, area and performance.

Dr. Tobias Bjerregaard, CEO and Founder of Teklatech, comments: “While introducing innovative new handles such as Pulse Softening and Auto Targets extensions, a big value of FloorDirector 3.5 lies in all the in-betweens: the speed-ups, usability improvements, and setup automation which make the daily use of FloorDirector a breeze. At Teklatech, this is our vision and mission come together: to enable advanced IC power integrity optimization with simple controls. And power integrity is key to design success at advanced process nodes”.

FloorDirector 3.5’s new Pulse Softening capability is specifically targeted for flip-chip designs at 28 nm and below. It allows for the softening of IC power pad currents, which is particular important when the goal is to reduce inductive package noise, where steep power currents cause L-drop across inductive package leads.

The scope of FloorDirector’s unique Auto Targets is also broadened in version 3.5 of the tool. Auto Targets are an intelligent and adaptive approach for a designer to easily explore optimization potential in a diverse solution space, by setting priorities across any number of design parameters such as timing, power noise and dynamic voltage drop. This represents a major break-through in the handling of the complex mix of targets and trade-offs inherent in advanced ASIC design flows.

Additionally, a host of features in the area of flexibility and automation have found their way into this release, largely by popular request from FloorDirector users.

FloorDirector 3.5 is available immediately to existing and new customers.