Cadence, Broadcom to collaborate on 5nm designs

14th January 2020
Mick Elliott

Cadence Design Systems and Broadcom have extended their collaboration to create semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications. Following successful 7nm designs, the companies will now work on creating 5nm designs using Cadence digital implementation solutions.

“As a global infrastructure technology leader, we’re committed to delivering innovative products that enable our customers to excel in their respective markets,” said Yuan Xing Lee, vice president and head, Central Engineering at Broadcom. “With Cadence as a key silicon design partner, we’re able to achieve our power and performance goals and provide our customers with the highest quality solutions that they’ve come to expect from us.”

“We’ve collaborated with Broadcom for many years, and our expanded partnership on advanced-node design development is a result of the series of successes we’ve had together over time and our overall digital technology leadership,” said Dr. Anirudh Devgan, presidentof Cadence. “Given the continued proliferation of networking, broadband, enterprise storage, wireless and industrial applications, we’re dedicated to ensuring that Broadcom achieves design excellence using our latest toolsets to fuel design innovation.”

The Cadence digital implementation solutions are part of the broader digital suite, which provides optimal power, performance and area (PPA) and reduced turnaround time.

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