Bonding with maximum precision

26th September 2022
Sheryl Miles

ASMPT Semiconductor Solutions (SEMI), a maker of mainstream and advanced equipment for semiconductor assembly and packaging, will exhibit its products at the Electronica 2022 trade fair being held 15 – 18 November 2022 in Munich.

The main focus of the company’s presence will be on wire bonding and die bonding machines.

Miniaturisation, cost pressures and higher demands on performance and functionality are just a few of the factors driving innovation in electronics manufacturing. One important approach to meeting these requirements is the integration of passive components in a package by integrating them into a printed circuit board or by combining the entire structure in a fan-out package (advanced packaging).

In the data centre, the exponentially rising volume of data requires ever faster processing speeds. To meet this need, ASMPT will present high-precision placement solutions for co-packaged optics where conventional copper wires are increasingly being replaced with faster and less trouble-prone fibreoptic connectors.

Two solutions form the main focus of ASMPT Semiconductor Solutions’ presence at the Electronica:

Eagle AERO: A gold and copper wire-bonder

The Eagle AERO opens a new dimension in high-end IC applications. Thanks to its innovative bonding process (X-Power), copper wire connections can be generated 30% faster than with previous bonders. The Eagle AERO can create up to 24 2-mm connections p/s with a bonding accuracy to 2,0μm at 3σ and a ball size that can be reduced to 22μm.

ASMPT’s AEROEYE real-time monitoring technology is in line with the trend towards Industry 4.0. Without compromising the machine’s UPH performance, it continuously checks critical parameters such as process stability and repeat accuracy along with other important bonding parameters. This ensures that the Eagle AERO delivers maximum performance at all times and any problems are recognised at an early stage. AEROEYE is the first step towards SkyEye, ASMPT Semiconductor Solutions’ approach to fully AIoT-supported production.


The AMICRA NANO supports all types of die-attach and flip-chip applications and achieves a placement accuracy Cmk value of ±0.2μm at 3σ. A high-resolution optical system with CCD cameras permanently monitors each part throughout the entire alignment and bonding process. A granite base place and bonding stage with high-precision linear motors minimises any interfering vibrations.

The AMICRA NANO’s die-bonding technology was designed specifically for the photonics assembly market, where super-accurate positioning is required for the eutectic high-speed Au-Sn bonding process. To accomplish this, four imaging systems are firmly mounted on a massive base plate while all other motion-controlled components move around the cameras.

More than bonding

“ASMPT SEMI’s offerings range from film deposition to bonding, moulding and trim-and-form to the integration of machines into complete inline systems for microelectronic, semiconductor, photonic, optoelectronic and end applications," explains Hubert Herzberg, Senior Director ASMPT SEMI Europe. "At our booth, visitors can see our industry-leading solutions in action and discuss their individual requirements with our experts."

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