Analogue mixed-signal tools for analog IC designs

Mentor’s Tanner AMS design tools are optimised for creating custom analog or “Analog on Top” mixed-signal integrated circuits (ICs), working on 22nm and above. Many leading IC providers use Mentor’s Tanner tools to design highly sophisticated AMS devices for a wide array of markets including the automotive, wearables and industrial Internet of Things (IoT) segments.

Greg Lebsack, General Manager for Integrated Circuit Design Systems at Mentor, said: “Many of the world’s fastest growing markets increasingly require specialised AMS chips that seamlessly bridge the analog and digital worlds. Mentor’s Tanner tools are specifically engineered to help IC designers meet this growing demand, while providing an ideal platform for the creation of highly innovative AMS designs. 

“The certification of our Tanner AMS tools for TSMC specialty processes supporting analog IC designs is great news for our customers because it enables faster time-to-market and helps minimise risk. Mentor’s Tanner AMS solutions and TSMC’s specialty processes for analog IC designs are truly a winning combination for our mutual customers.”

TSMC’s iPDKs for specialty process technologies help chipmakers meet the specific requirements of leading-edge AMS IC designs. Mentor AMS tools are now certified for many of the foundry’s iPDKs, including 22nm ultra low power, 28nm high performance computing, 40nm mixed-signal technologies, as well as other specialty process technologies for today’s most advanced analog ICs.

“Our ongoing collaboration with Mentor helps to ensure that the EDA solutions and services our mutual customers need for their successful silicon designs and manufacturing on specialty nodes are available and supported,” added Suk Lee, TSMC Senior Director, Design Infrastructure Management Division. “This joint effort combines TSMC’s specialty process technologies with Mentor’s advanced design tools, enabling our customers’ innovation success in a broad range of market segments, including automotive, smart wearables and industrial Internet of Things.”