Alphawave, Samsung partnership extended to 2nm processes

11th June 2024
Mick Elliott

Alphawave Semi has expanded its strategic partnership with Samsung Foundry. The expanded agreement encompasses leading-edge IP for PCI Express 7.0, 112G and 224G Ethernet and the latest UCIe (Universal Chiplet Interconnect Express) die-to-die interconnect standard that is enabling next-generation SoC (system-on-chip) technologies for AI and other HPC systems.

The partnership is based on an extensive range of IP aimed at minimizing design risks and propelling the success of high-performance silicon and next-generation chiplets for sectors such as artificial intelligence (AI), high-performance computing (HPC), data networking, autonomous vehicles and solid-state storage (SSD).

The latest expansion of the collaboration expands these offerings for Samsung’s cutting-edge SF5 (5nm), SF4 (4nm), and SF2 (2nm) processes with additional, state-of-the-art IP that is essential for next-generation compute and network connectivity.

"Strengthening our collaboration with Samsung Foundry marks a significant step forward in our mission to drive the future of high-speed connectivity," said Alphawave Semi CTO Tony Chan Carusone. "This partnership leverages both Alphawave Semi’s leading-edge IP portfolio and Samsung’s manufacturing prowess to meet the fast-growing demands of high-performance computing and networking."

"We are excited to strengthen our partnership with Alphawave Semi," said Jongshin Shin, Corporate EVP of foundry IP development at Samsung Foundry. "By harnessing their cutting-edge IP technologies alongside our advanced semiconductor processes, this collaboration is set to redefine benchmarks for high-speed connectivity and high-performance computing, supporting the ongoing evolution and success of next-generation AI systems and network solutions."

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