The capabilities and breakthroughs now available to new and existing ADS users include:
oUser interface enhancements designed to improve design efficiency and productivity, such as dockable windows for quickly accessing frequently used dialog boxes.
oUpdated Load Pull and Amplifier DesignGuides, which offer mismatch simulation and make it easy to see amplifier performance at a specific output power level or a specific amount of gain, respectively.
oDramatically improved integration with EMPro, which enables 3-D electromagnetic component designs to be saved as database cells for use directly in ADS.
oA new ADS electro-thermal simulator that incorporates dynamic temperature effects to improve accuracy in “thermally aware” circuit-simulation results.
oMultichip module electromagnetic simulation setup and Finite Element Method simulation of different technologies to analyze electromagnetic interactions between circuits and interconnects, wire bond and flip-chip solder bumps in typical multichip RF power-amplifier modules.
oModel support for Agilent’s artificial neural network-based NeuroFET model (extracted by Agilent’s IC-CAP device modeling software) to enable more accurate FET modeling and simulation results.
Currently supported Agilent customers interested in the ADS 2012 breakthroughs and features should contact their local applications engineer or field sales person for more information.