Design

Adeneo Embedded provides Windows Embedded CE 6.0 drivers for TI’s WiLink™ 6.0 connectivity solution

7th September 2010
ES Admin
0
Adeneo Embedded, a Microsoft® Windows® Embedded Gold Partner with facilities in Europe and in the USA, today announced availability of its Wi-Fi® and Bluetooth® technology drivers for the WiLink™ 6.0 single-chip solution (WL1271) from Texas Instruments Incorporated (TI) which support Windows Embedded CE 6.0 R3. The customizable, combined solution makes the design of reliable, high-performance wireless communications on the Windows Embedded CE operating system more efficient.
/> The WiLink 6.0 solution is a single-chip, wireless combo chipset encompassing all digital and analog content required for WLAN and Bluetooth technology communications.

Adeneo Embedded initially developed the Windows Embedded CE 6.0 R3 drivers on TI’s OMAP35x evaluation module (EVM) leveraging the OMAP35x applications processor. The technical design of the drivers will enable the Adeneo Embedded products to extend to future OMAP™ platforms. Adeneo Embedded is also working aggressively with TI to establish similar catalog drivers for mass market support, ensuring quicker delivery to customers not requiring heavy customization.

The Adeneo Embedded drivers are compliant with Microsoft’s Production Quality Device (PQD) specifications. This helps OEMs focus on adapting only specific, necessary portions of code via the embedded drivers. As a result of this PQD compliance, integration of TI’s WiLink 6.0 solution is cost-effective and efficient in both customized and standard designs.

Driver Highlights
• Microsoft PQD compliance saves customers time and money by clearly separating chipset- and board-dependent features
• Only portions of the drivers related to board interfaces need to be reviewed and redesigned
• All code linked to the core chipset can be reused without modifications
• Drivers are qualified via Windows Embedded CE Test Kit (CETK)

“Our customers consistently look to us to better enable development processes and quicken go-to-market cycles. The development of the Adeneo Embedded Windows Embedded CE 6.0 R3 drivers for our WiLink 6.0 solution helps answer this customer demand. TI’s proven wireless connectivity capabilities are now available in packaged, ready-to-go joint solutions for fast, efficient designs. Our customers can also receive tailored, skillful support through the Adeneo Embedded expert team,” said Doug Wilson, general manager, emerging connectivity solutions business, TI.

“Microsoft is excited to be working with Adeneo Embedded,” said Valerie Olague, senior partner marketing manager for Windows Embedded at Microsoft Corp. “Windows Embedded CE 6.0 R3, combined with the expertise of Adeneo Embedded and Texas Instruments, ensures the latest wireless communication technologies are at the fingertips of OEMs.”

Enabled Features
• Full featured evaluation version of the Adeneo Embedded Bluetooth Manager, delivering enhanced communication management with support for local and remote Bluetooth profiles.
• Range-extended mobile WLAN and Bluetooth technology
• Supports Bluetooth v2.1 + EDR specifications
• Supports IEEE 802.11 b/g/n capabilities
• Sophisticated ELP™ low-power technology with on-chip processing optimizations for extended battery life

The capabilities and communication performances of WiLink 6.0 solution, combined with the Adeneo Embedded system-integration expertise will spur OEMs’ design success, said Yannick Chammings, chief executive officer, Adeneo Embedded. As a participant of TI’s developer network, we combine intimate knowledge of TI solutions with expertise in Windows Embedded CE development and system integration to secure smooth and efficient progression of customers’ designs.”

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