Ericsson Introduces New Power Design Toolbox to Deliver Board Energy Savings
Ericsson has introduced the world’s first ‘toolbox’ that enables systems architects to optimize power profiles and energy configuration prior to implementation in end equipment. The 3E Design Toolbox includes a set of five modules that can be operated as stand-alone devices or interconnected to mirror complex applications requiring multiple power rails with specific configuration profiles such as sequencing, tracking, and load sharing and distribution.The
“Energy saving is uppermost in everyone’s mind these days and Ericsson has demonstrated that digital power is an important enabler to achieve lower energy consumption,” said Patrick Le Fèvre, Marketing and Communication Director, Ericsson Power Modules. “The exceptionally high level of interest in digital power among engineers and power architects is extremely encouraging, and we expect that this new 3E Design Toolbox will reduce both learning time and time-to-market, enabling engineers to quickly and easily optimize energy delivered to core components in their board-level designs.”
The Ericsson 3E Design Toolbox includes:
• The ROA1285151 (PIM Module) hosts a combined socket that is compatible with the industry-standard 400W PIM4300 series of power interface modules and the recently launched 800W PIM4800 series, including PMBus interface, hold-up capacitors and all the required circuitry to mirror the input stage that is commonly used in ICT (Information and Communications Technology) applications.
• The ROA1283835 (ABC Module) has room for two Advanced Bus Converters (ABCs) from the FRIDA I series – the quarter-brick BMR453 and eighth-brick BMR454 – and the FRIDA II series’ quarter-brick BMR456 and shortly available eighth-brick BMR457.
• The ROA1283836 (3E POL PI Module) is equipped with six connectors making it able to host hole-through 3E Point-Of-Load (POL) converters. Two sockets are dedicated to the 40A BMR464; four can host the 20A BMR463; and additionally, two out the four can be used for the 12A BMR462. For simple systems, each 3E POL can be tested independently from the others or, for more advanced power configuration, combined in different ways such as paralleling.
• The ROA1285068 (3E POL SIP Module) offers the same possibilities as those offered by the previous board, the ROA1283836, but it is dedicated to the single-in-line version of the 3E POL, which is commonly used in high-density space-critical boards.
• Finally, the ROA1285077 (3E POL Paralleling Module) is dedicated for high-power applications that require high current up to 280A. In addition it offers the flexibility to optimize energy consumption by turning off part of the set of 3E POLs under low-load conditions; and also, when the load demands maximum power, the ability to quickly switch on up to seven 3E POL BMR464s in parallel. The layout of the ROA1285077 module has also been optimized to reproduce end-user applications, simplifying the optimization of the configuration scheme when it is implemented into an end application.
Each module is furnished with high- and low-signal connectors, local filtering, and low-impedance sockets to host 3E Point-of-Load converters, Advanced Bus Converters and power interface modules. Comprehensive documentation includes user guide, application notes, design notes and various technical papers that can assist systems board designers to optimize the power configuration to reduce energy consumption. The Ericsson 3E Design Toolbox also includes the 3E Software and additional accessories such as the KEP91017 USB-to-PMBus adaptor.
Each board can be purchased separately as a stand-alone product. The 3E design boards are also available to power systems architects for free hire across the duration of their design period, via the Ericsson (Power Modules) 3E Design Registration process.
In June 2008, through close cooperation with board and systems designers, Ericsson was the first company to release a 21st century 3E power architecture composed of PMBus-compliant ABCs and POL converters that can be fully integrated into the rest of the digital chain of processors and associated components.
* 3E stands for: Enhanced Performance, Energy Management, and End-user Value.
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