Component Management

Versatile thermal interface material from Fujipoly

24th November 2015
Peter Smith

Sarcon GR80A, from Fujipoly, is a soft, high-performance thermal interface material that exhibits a low thermal resistance and can be supplied in sheets from 0.3mm to 3.0mm thick and can be die-cut to fit almost any application shape.  

When placed between a heat source like a semiconductor and a nearby heat sink, the material provides a thermal conductivity of 13.0 W/m°K per ASTM D5470 (8.0 W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 0.50°C cm2/W.

The silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas while exhibiting very low pressure. This significantly increases surface contact with a heatsink and improves cooling performance. Sarcon GR80A can be ordered in convenient pre-cut sheets up to a maximum size of 300mm x 200mm.

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