When placed between a heat source like a semiconductor and a nearby heat sink, the material provides a thermal conductivity of 13.0 W/m°K per ASTM D5470 (8.0 W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 0.50°C cm2/W.
The silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas while exhibiting very low pressure. This significantly increases surface contact with a heatsink and improves cooling performance. Sarcon GR80A can be ordered in convenient pre-cut sheets up to a maximum size of 300mm x 200mm.