Two component epoxy with thermal shock resistance
Master Bond EP110F8-3 is a two part epoxy system ideal for sealing, encapsulating, potting, and casting applications. “This toughened system provides very good flexibility and possesses a relatively high elongation of 120-150%”, said Rohit Ramnath, Senior Product Engineer. “It offers a low tensile modulus of around 5,000-15,000 psi and a shore A hardness of 40-50 at room temperature."
EP110F8-3 features excellent thermal cycling and shock resistance, passing 10 cycles from -55°C to +125°C with no signs of cracking. It has a superior electrical insulation profile with a low dielectric constant of 2.67 as well as a low dissipation factor of 0.006, both measured at 75°F for 1KHz.
EP110F8-3 has a convenient mix ratio of one to two by weight; the color of Part A is clear while the color of Part B is amber. It has a low mixed viscosity of 1,000-2,000cps and flows readily. Working life for a 100g batch is 2-3 days at room temperature and can be cured within a few hours at 250-300°F.
Master Bond EP110F8-3 is a two part heat curing epoxy system for potting, sealing, encapsulation and casting applications, with unsurpassed electrical insulation and thermal cycling capabilities.
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