Component Management

Thermaltronics receives fourth award for soldering robot

29th April 2019
Lanna Cooper

Thermaltronics announced that it was awarded a 2019 EM Asia Innovation Award in the category of Soldering Systems - Soldering Robot for its TMT-R9800S Solder Robot. The award was presented to the company during a ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. The company also has been recognised by the 2018 Global Technology Awards, 2019 NPI Awards, and 2019 SMT China Vision Awards for its TMT-RS9800S Solder Robot.

The TMS-RS9800S features an observation mode, a verification mode and decision-making capabilities. This capability to collect and utilise data for production processing is one of the most important factors necessary to meet the requirements of Industry 4.0 standards.

Thermaltronics Curie Heat Technology (CHT) responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material. The company’s hand soldering products include both 13.56MHz and 470KHz power supplies and are fully compatible with competitive product offerings.

The latest versions of the Thermaltronics’ soldering robot are now available with solder flux/paste capability, nitrogen option and desolder function. The company’s ability to provide accuracy and repeatability is proving to be a determining factor in system selection.

Established in 2006, the EM Asia Innovation Awards programme strives to recognise and celebrate excellence in the Asian electronics industry, inspiring companies to achieve the highest standards and push the industry forward.

In addition to the hand soldering product line, Thermaltronics also provides an extended range of accessories to support both production and rework applications.

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