Thermal compound provides excellent vibration absorption

  Among the industry’s highest performance form-in-place gap filler compounds, SARCON SPG-50A from Fujipoly is a 5.0 W/m°K silicone based material suited for electronic devices that have delicate components or ultra-low compression force requirements.

The form stable SPG-50A material fills large gaps around fragile circuit board solder points without causing damage or loss in performance. This facilitates efficient transfer of heat from any board-level source to a nearby heat sink or heat spreader.

Due to its unique composition, this thermal compound provides excellent vibration absorption capabilities and maintains all initial properties across a wide temperature range from -40 to +150°C. SARCON SPG-50A is available in easy-to-use tubes or syringes.

Keep Up to Date with the Most Important News

By pressing the Subscribe button, you confirm that you have read and are agreeing to our Privacy Policy and Terms of Use
Previous Post

Virtural becomes reality at CES

Next Post

6U OpenVPX Gigabit & 10/40Gigabit L3+ Ethernet switch & IP router