The 2.5mm thick material improves cooling performance by filling unwanted air gaps between board components and processors thereby increasing surface contact with a heatsink.
Sarcon 250G-HF2d transfers heat with a thermal conductivity of 1.5W/m°K according to ASTM D2326 and a thermal resistance of 2.61°Cin2/W at 14.5PSI (16.81°Ccm2/W at 100Kpa). This flame retardant TIM is available in precut sheets up to 300x200mm and can be die-cut or trimmed to fit your components. Depending on gap size, additional material thicknesses are available ranging from 0.5 to 5.0mm.