SN100CV P506 D4 is a lead-free, no-clean solder paste with a basic composition of (Sn-Cu-Ni+Ge+Bi). This new alloy has an addition that enables thermally stable solder joints even after thermal cycling. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. The unique ability of SN100CVP506 D4 to survive long-term storage at room temperature allows simplification of stock management while meeting all the requirements of modern reflow soldering processes.
New solder paste at SMTA International
Nihon Superior is to exhibit at SMTA International and will showcase its SN100CV P506 D4 lead-free alloy which provides faster wetting and increased spreadability over SAC305 – which is beneficial in wave soldering and hand soldering applications as well as in reflow.