New joint-enhanced solder paste series released
SHENMAO America has introduced its Joint-Enhanced Solder Paste (JEP) PF606-EP Series. JEP offers the advantages of both traditional solder paste and anisotropic conductive paste. The residue from the PF606-EP Series provides excellent bonding strength and joint protection, thus enhancing joint reliability. JEP is compatible with various surface finishes.
Additionally, the no-clean paste leaves a transparent residue; ensuring luminous flux is unaffected for LED die attach applications.
“The new paste enables our customers to perform one-step reflow for soldering and joint enhancement," stated Watson Tseng, General Manager of SHENMAO America.
SHENMAO has successfully been approved by many international electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America blends SMT solder paste at its facility in San Jose, CA for distribution in North America.