Over the past several years and for an increasing number of electronic assemblers, contamination removal from post-reflow circuit assemblies has transitioned from an optional to a mandatory process. Ironically, as more assemblies require cleaning, the process of contamination removal has become increasingly challenging.
Higher component densities, lower stand-off component heights and higher reflow temperatures have combined forces that make it both important to remove contamination and difficult to do so. The company’s presentation addressed conventional cleaning challenges associated with modern assembly and component designs as well as the chemical and mechanical designs required to meet this challenge.
Modern assembly designs not only dictate latest approaches to cleaning, they also change cleanliness testing criteria. The cleanliness ‘pass/fail’ criteria used since the 1970s is, for many assemblers, outdated.
