Component Management
High strength epoxy does not contain antimony
Engineered Material Systems is pleased to debut its 535-11M-7 UV cured epoxy, which has been developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications. The non-conductive UV cured adhesive is low outgassing,flexible, high strength and does not contain antimony and cures rapidly when exposed to high intensity UV light.
The 535-11M-7 is an ultra-low stress, lower glass transition temperature version of the 535-10M-1 UV cured adhesive. The epoxy can be used for lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.
Product Spotlight
APV1111GVY
Panasonic
Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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| Stock: | 3490 |
| Cost: | $3.95 |
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8th August 2024
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