The 535-11M-7 is an ultra-low stress, lower glass transition temperature version of the 535-10M-1 UV cured adhesive. The epoxy can be used for lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.
High strength epoxy does not contain antimony
Engineered Material Systems is pleased to debut its 535-11M-7 UV cured epoxy, which has been developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications. The non-conductive UV cured adhesive is low outgassing,flexible, high strength and does not contain antimony and cures rapidly when exposed to high intensity UV light.