Component Management

High-quality stencil cleaning at productronica

26th October 2015
Peter Smith

KYZEN is using this year's productronica to showcase a suite of high precision cleaning products engineered specifically to reliably achieve demanding stencil cleaning performance requirements. The company will demonstrate its AQUANOX A8830, AQUANOX A8820 and CYBERSOLV C8882 which have proven compatibility with coatings and all materials used in electronic assembly manufacturing and cleaning processes.

AQUANOX A8830 is an ultra-low VOC, environmentally progressive formulation that is highly effective at removing all types of solder pastes (water soluble, rosin, and no-clean) from fine-pitch apertures.

A8830 is a low odor cleaner that operates in open systems. The state-of-the-art environmental properties of A8830 make it an ideal option for areas where air emissions are highly regulated.

AQUANOX A8820 effectively removes common solder pastes and fluxes, and demonstrates a favorable compatibility profile with stencil cleaning systems. It works well with spray-in-air and select ultrasonic cleaning machines, and is effective on uncured adhesives. Additionally, the no-foaming property of A8820 is compatible with all materials commonly used in electronic assembly manufacturing and cleaning processes.

CYBERSOLV C8882 is a fast-acting stencil cleaning solvent designed for the under-stencil on printer wipe cleaning process. The solvent dries quickly, eliminating the streaking and smearing experienced with traditional cleaning solvents. C8882 is non-flammable, removes all flux types, and does not interact with or remove nano-coatings.

They are all available in five, 25 and 200 litre drums.

 

 

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