Component Management

Heat dissipation solution with the WE-TGF from Würth

3rd September 2020
Alex Lynn

With its WE-TGF (Thermal Gap Filler) Würth Elektronik has announced that it now offers a new solution for heat dissipation. The key feature of the self-adhesive gap-filler material is the non-conductive barrier with a high dielectric strength has a high thermoconductivity index of 1 W/(m*K).

The material easily adapts to the differing thicknesses of components on the PCB and fills the gaps between hot electronic components and metal casings or cooling components.

WE-TGF is made of silicone incorporating ceramic particles. For applications in which the PCB is screwed onto a metal plate, the material is also reinforced with a glass-fibre mesh. The thermoconductive gap filler is suited for use e.g. in power electronics, entertainment technology, or in networking devices.

WE-TGF is available ex stock in a variety of dimensions and in thicknesses ranging from 0.23 to 5mm. Developers working in the prototype construction area can request individually cut samples, which are shipped within 48 hours of ordering. Customization comes at no extra charge for the customer.

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