Component Management

Form-in-Place filler plugs large gaps

28th March 2017
Peter Smith

SARCON SPG-30B from Fujipoly is a new form-in-place thermal gap filler that eliminates performance-hindering air gaps ranging from .08mm to 1.0mm. SPG-30B is said to deliver a superior thermal conductivity of 3.1 W/m°K with a thermal resistance of only 0.33°Cin2/W. 

The ultra-low compression force silicone compound completely fills all spaces, gaps and protrusions when compressed between a heat source and a nearby heat sink or spreader. The material is easy to apply and does not require heat curing. This Fujipoly TIM also exhibits excellent vibration absorption and electrical insulation properties.

The form stable thermal compound will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40C to + 150C). SARCON® SPG-30B is available in 30ml pre-filled syringes or 325ml cartridges. 

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