Additionally, he will discuss how to identify which area within a solder joint is preventing a high level of solder quality, so that a suitable technique can be used to improve soldering in this location. Clure will show data of actual preheat cycles performed on various test vehicles using different preheating methods, as well assettings to show how to most effectively use this process for various PCB designs.
Clure is based out of Ersa North America, located in Plymouth, WI. He has more than 15 years of experience in the electronics soldering industry, working with numerous contract manufacturers and OEMs, developing processes for and building products to all classes of IPC and OEM specifications.
Clure held a process engineer position at a large electronics contract manufacturer that is globally known as a leader in the soldering industry where he was the regional selective soldering subject matter expert for all locations in North America and Mexico. Clure holds degrees from Universities in New York, Wisconsin, and the United States Navy’s Nuclear Power Program.