Dry film negative photoresist optimized for MEMs applications
Engineered Material Systems, Inc has introduced the DF-3010 dry film negative photoresist optimized for hot roll lamination and processing on MEMS and IC wafers.
DF-3010 is available in other thickness formats from 5 to 50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-3010 film is tougher (less brittle) than most negative photoresists on the market with a glass transition temperature of 158°C (By DMA Tan Delta) and a moderate modulus of 3.5 GPa at 25°C. It is hydrophobic in nature, providing for chemical and moisture resistance. DF-3010 is compatible with and can be used in contact with the EMS line of spin coatable photoresists.
DF-3010 is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits.
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