Component Management

Cost saving is possible through thermal process optimization

4th May 2017
KIC
Peter Smith

KIC has announced plans to exhibit with SmartRep at SMT Hybrid Packaging - May 16-18 - in Nuremberg. KIC’s representatives will showcase the new KIC SPS thermal profiler and Vantage network intelligence system.

The new SPS reflow profiler transforms thermal process data collection from a costly chore to a value-added function. The core function of a reflow oven is to produce an acceptable profile on each PCB. The new KIC SPS smart profiler collects the profile data and compares it to the process specifications. Within seconds, the new smart profiler also suggests an improved reflow oven setup.

The new thermal profiler features a slick compact design made with an LCP (Liquid Crystal Polymer) enclosure for better heat protection and faster cool-down between profiles. It utilizes a rechargeable battery, profile stacking, Wi-Fi and Bluetooth for wireless data communication plus much more. This all-new smart thermal profiler design has been optimized for maximum thermal protection plus robust long-term operation. 

Additionally, the KIC Vantage network intelligence system will be demonstrated. The KIC Vantage is an ecosystem that automatically acquires and delivers insightful information from all the ovens in the factory in real-time to allow factories to produce consistent quality at lower costs. The software is retrofitable and can connect to the factory MES system.

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