Key features of the new surface mount machine include the ability to place components from 01005 (0.010 x 0.0005in) to 50x50mm and print solder to 0204 size pads without a stencil using an Automatic Dispense unit. It also incorporates an intelligent feeding system to offer full component traceability to individual PCBs and vision recognition for components’ package shape, size and identity markings. An integrated software package inputs CAD data for fast and reliable manufacturing data.
Tim Waterman, Technical Director at Corintech said: “Over the last couple of decades, PCB production has evolved from a labour-intensive process to a more automated one. This new machine allows us to take surface mount to the next level by being able to work with smaller and more intricate components, and at a faster rate. This is a significant investment not just for our company, but also for UK electronics manufacturing more broadly. Having these high quality and advanced capabilities onshore in the UK will give our customers huge advantages.”
The new surface mount facility adds to Corintech’s range of electronics manufacturing capabilities, which includes conventional electronic assembly, thick film hybrids and chip on board wire bonding.